Adhesive Bead Detection
Application: Verifying that adhesive is present
Challenges: Chips move at a fast speed along the production line
Solution: DF-G1 Fiber Optic Amplifier
Benefits: Fast response speed
To verify that adhesive is being applied properly to trays of IC chips.
Description
The DF-G1 fiber amplifer with the fiber optic sensing tip positioned near where the robot applies the adhesive, verifies that adhesive is applied to the IC chips. An additional DF-G1 is used to reliably detect the leading edge of the IC to triger adhesive bead application.