Solutions for Unique and Demanding Semiconductor Equipment Applications
Semiconductor equipment design engineers throughout the world rely on Banner’s broad product offering, capacity for rapid product customization, and application solution experts to solve their most challenging applications.
Tradeshow24 - 26 Apr, 2018
NEPCON China is a professional trade platform and exhibition on SMT (surface mount technology) and EMA (electronics manufacturing automation). The exhibition is a vibrant showcase for all brands from across the SMT world. Visit us at the Banner booth # 1C12!
By pairing Banner’s DF-G2 with four opposed mode PLIS-1 fiber optics, operators can ensure the wafer is on the robotic arm’s end effecter correctly so that no damage is done when passing it into the chamber. As the robotic arm moves the wafer into the chamber, the fiber optic beams will break and an algorithm will calculate the exact wafer position based on when the fiber sensing beams are broken. Banner’s DF-G2 has a fast response time and can quickly measure and detect the wafer’s center.Read More
In this application, machine operators require access to the wafer carrier station. The EZ-SCREEN ESD safety light curtain system is configured to safeguard the process and operator using emitters, receivers and mirrors to enclose three sides of the station. Safety light curtains allow quicker, easier access than physical barriers while preventing machine movement if the operator reaches into the hazardous zone.Read More
The lead frame of an integrated circuit moves on a U-shaped channel toward the cassette that holds multiple frames. The D10 Expert Analog/Discrete sensor detects the leading and trailing edge, to signal to the cassette that the lead frame is approaching. The sensor operates in the opposed mode, because large differences in reflectivity of frame materials make diffuse sensing impossible.Read More
In the process of die bonding and wire bonding, lead frames are conveyed in a tall vertical cassette. To increase throughput, the cassettes are inspected to determine if a lead frame is present in each slot. Because the lead frame can be as thin as 0.1 mm, it can be difficult to sense. The VS1 convergent sensor easily senses this thin profile, as well as non-reflective plastic ball grid arrays (PBGA).Read More