Solder Ball Inspection
Challenge
Electronic production and assembly operations often use integrated circuits that include BGAs (ball grid arrays). BGAs have solder balls that form the electrical bridge between the package and board assembly. It is critical that all the solder balls in the array exist and that there is no foreign matter that interferes with the circuitry.
Solution
To verify each integrated circuit, this application uses an iVu Series sensor configured for an Area with Motion application. If the sensor detects a part with missing or damaged solder balls, or if it detects any foreign material, the sensor sends a fail output to the line, and the part is rejected.
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