Detección de la Ruptura de un Cable de Conexión con un Par de Fibras Ópticas
Customer Requirements: Detecting breakage of very fine wire during operation/assembly
Solution: DF-G2 Fiber Optic Amplifier
Why Banner? Fast Response Time – 10 microsecond response time recognizes very fine wire that breaks the beams
Compact – sleek 10 mm wide housing mounts to 35 mm DIN rail fits into small areas
Reto
Detectar rápidamente la ruptura del alambre puede prevenir tiempos muertos y errores. Para detectar con precisión cuando se rompe un cable, se necesita un sensor para monitorear el espacio debajo del cable.
Solución
Consistent Quality Control – Accurately detecting bonding wire breakage ensures that high quality products are being produced, reducing the amount of scrapped product as well as costly downtime
Background
Un par de fibras ópticas en modo opuesto son colocadas debajo del cable de conexión. Cuando el cable se rompe y cae a través del haz de luz, se energiza una salida ajustable one-shot y se envía un pulso.
Esta aplicación no requiere que el alambre de conexión tenga un posicionamiento consistente.
La serie de DF-G2 tiene un tiempo de respuesta de hasta 10 microsegundos, lo que le permite responder de manera rápida y eficiente a la ruptura del alambre.
Challenges
In semiconductor assembly, very fine wires are used to connect various components. As a wire is threaded to a die it can easily break. These products will not work as intended and must be scrapped. Unscheduled downtime to rethread the wire and high scrap rates reduce production output and drive up costs. Detecting bonding wire breakages as they occur allows manufacturers to halt assembly, correct issues, and minimize the number of affected components.
Solution
To help correctly and quickly identify a break, the thru-beam fiber pair is set up below the bond wire. When the broken wire falls through the beam, an adjustable one-shot output pulse is energized and an alert is signaled so that the operators can rethread the bonding wire. If the sensor is not quick enough, the break will not get recognized.
Offering best in class response speeds, the compact DF-G2 fiber amplifier is an ideal solution for this application. Fast and consistent detection of bonding wire breaks is possible with a 10 microsecond response time and the 10mm wide housing allows for more versatility during installation, especially in tight or confined spaces. Choosing the DF-G2 for this application also does not require a consistent positioning of the bonding wire.
Conclusion
Semiconductors and electronics are designed with incredibly small components and as devices get smaller, the components used to make them become smaller, making reliable sensing more difficult. With best in class response time and compact 10 mm housing, the DF-G2 can detect the most subtle movements and works very well in the semiconductor industry.