까다롭고 고유한 반도체 장비 응용 분야를 위한 솔루션
전 세계 반도체 장비 설계 엔지니어들은 가장 까다로운 응용 분야의 문제 해결을 위해 Banner의 광범위한 제품, 신속한 제품 맞춤화를 위한 역량과 응용 분야 솔루션 관련 전문 지식에 기대고 있습니다.
The lead frame of an integrated circuit moves on a U-shaped channel toward the cassette that holds multiple frames. The D10 Expert Analog/Discrete sensor detects the leading and trailing edge, to signal to the cassette that the lead frame is approaching. The sensor operates in the opposed mode, because large differences in reflectivity of frame materials make diffuse sensing impossible.
In the process of die bonding and wire bonding, lead frames are conveyed in a tall vertical cassette. To increase throughput, the cassettes are inspected to determine if a lead frame is present in each slot. Because the lead frame can be as thin as 0.1 mm, it can be difficult to sense. The VS1 convergent sensor easily senses this thin profile, as well as non-reflective plastic ball grid arrays (PBGA).
In this application, machine operators require access to the wafer carrier station. The EZ-SCREEN ESD safety light curtain system is configured to safeguard the process and operator using emitters, receivers and mirrors to enclose three sides of the station. Safety light curtains allow quicker, easier access than physical barriers while preventing machine movement if the operator reaches into the hazardous zone.