모든 반도체 솔루션

  1. Banner의 DF-G2를 대향 모드 PLIS-1 광섬유 4개와 함께 사용하면 체임버로 전달 시 웨이퍼가 손상되지 않도록 로봇 암의 엔드 이펙터에 올바르게 올라가 있는지 작업자가 확인할 수 있습니다. 로봇 암이 웨이퍼를 체임버로 이동할 때 광섬유 빔이 차단되어 알고리즘이 광섬유 감지 빔이 차단되는 시점을 기준으로 정확한 웨이퍼 위치를 계산합니다. Banner의 DF-G2는 응답 시간이 빨라 웨이퍼 중심을 빠르게 측정 및 감지할 수 있습니다.

  2. A precise measurement solution is required to ensure that integrated circuit (IC) chips are present and oriented correctly in nests. Learn how the LM laser measurement sensor solves this application.

  3. In this application, machine operators require access to the wafer carrier station. The EZ-SCREEN ESD safety light curtain system is configured to safeguard the process and operator using emitters, receivers and mirrors to enclose three sides of the station. Safety light curtains allow quicker, easier access than physical barriers while preventing machine movement if the operator reaches into the hazardous zone.

  4. A semiconductor fab needs to monitor temperature, relative humidity, and oxygen levels at multiple points within their processing plant, along a 2 kilometer long process piping system. They require a solution that monitors temperature, relative humidity, and oxygen levels, provides a location for the monitoring points, and collects all data to a central point and interfaces with their SCADA system. The solution needs to create an efficient, safe work environment for all employees. With over 2 kilometers of underground tunnel piping systems, installing cable to each monitoring location is cost prohibitive.

  5. Banner’s WLS27 are rugged LED strip lights specifically developed to provide brilliant, even illumination in challenging environments and compact spaces. They have a space-saving, aerodynamic design, are fully encapsulated in a protective shell, and come in a broad range of illumination color options. Machine designers can install WLS27 LED strip lights wherever they are best suited to illuminate a work area without making costly or time consuming modifications to the lights.

  6. In the process of die bonding and wire bonding, lead frames are conveyed in a tall vertical cassette. To increase throughput, the cassettes are inspected to determine if a lead frame is present in each slot. Because the lead frame can be as thin as 0.1 mm, it can be difficult to sense. The VS1 convergent sensor easily senses this thin profile, as well as non-reflective plastic ball grid arrays (PBGA).

  7. PicoDot sensors are positioned to sense the edge of the same wafer at the same time. If only one sensor detects a wafer edge, that wafer is most likely inserted at an angle, or cross slotted.

  8. The fibers of the D10 Expert sensor move along the stack of wafers in the cassette, mapping which slots are occupied and which are empty. The bargraph displays the sensor's status.

  9. A semiconductor company requested a sensor to detect breakage of very fine wire during assembly to eliminate unscheduled downtime.

  10. The lead frame of an integrated circuit moves on a U-shaped channel toward the cassette that holds multiple frames. The D10 Expert Analog/Discrete sensor detects the leading and trailing edge, to signal to the cassette that the lead frame is approaching. The sensor operates in the opposed mode, because large differences in reflectivity of frame materials make diffuse sensing impossible.

  11. The bussable power feature of the D10 Expert allows for up to 16 sensors to be wired together and powered through one power supply, reducing the amount of wiring required and making it possible to use multiple sensors without needing multiple connection points. Space can be further conserved by mounting the sensors together on a DIN rail, utilizing fiber optics to monitor multiple inspection points in a confined space.