Electronics

Solutions to Challenging Electronics Assembly Applications

Electronics equipment manufacturers and electronics manufacturing services (EMS) companies around the world choose products and solutions from Banner Engineering to help them reduce expenses, improve processes and increase product quality and output.

We are automation experts offering a broad range of sensors, vision sensors, safety control, LED lights and indicators, and a capacity for rapid customization. Combined with our rich industry and application knowledge, we are able to provide equipment manufacturers and manufacturing service companies with tremendous depth and flexibility to solve the most challenging electronics assembly applications.

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Featured Applications

Tape Detection - Film can be damaged during the automatic winding process and needs to be removed to prevent further defects. Green or yellow tape is applied to sections of film where a tear or other type of damage has been identified. The DF-G2 fiber optic amplifier paired with tight bend radius fibers and white LEDs detects the translucent green and yellow tape so the machine accurately cuts out the damaged sections.

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More Applications

Part Flaw Detection

To verify an electronic component like that shown, an image of a good part was captured using an iVu Series sensor configured for a Match inspection. If the sensor detects a part with a bent or missing connector, or if the part is wrong side up, the sensor sends a fail output to the line, and the part is rejected.

Hard Disk Detection

Because disk surfaces are shiny, many sensors have difficulty detecting whether a hard disk is properly seated in a hard drive. Banner Engineering’s Q3X and Q4X sensors are designed to detect shiny surfaces with a wide variety of colors, textures, and materials.

Fine Detail Inspection of Mobile Electronic Devices

Cell phones and other mobile electronics have densely populated components on their printed circuit boards. A VE Smart Camera is used to capture all the fine details and ensure that all components are present and placed correctly. Using a camera eliminates the risk of human error and prevents malfunctions and recalls.

Adhesive Bead Detection

The D10 Expert sensor, with the fiber optic sensing tip positioned near where the robot applies the adhesive, verifies that adhesive is applied to the IC chips. Opposed pairs of VS2 sensors detect when the level of filled wafer trays exceeds a preset height.

Adhesive Detection on PCB Assembly During the Assembly Process

Banner Engineering’s miniature VS8 sensor fits atop a glue gun to accurately detect the presence of adhesive as it is being applied. The VS8 is taught the distance between glue gun and PCB and can detect the very small height distance after the adhesive gets applied and recognize if there are any gaps or bubbles. The miniature sensors fit into tight spaces common in electronics assembly.

Lower-Risk Machine Guarding: Chip Shooter

The Type 2 EZ-SCREEN safety light screen guards the opening to a chip shooter, which has moving parts that can cause painful but usually temporary injuries.

Counting Memory Sticks

As memory sticks used in digital devices pass on a conveyor, the WORLD-BEAM Q12 counts the sticks by detecting the slight difference in height between the stick and the conveyor belt.

Counting Integrated Circuits

In order to detect these chips as they move down the conveyor, powerful sensors need to rapidly and accurately count them, but there are not many sensors that are tiny enough to fit into tight, confined spaces and still have reliable, speedy detection that keeps up with the integrated circuits as they pass by. With Banner’s ultra-miniature compact Q12 sensor, counting integrated circuits on the manufacturing line is simple.